Gianluca F.

-Electronic engineer Ph.D., with a strong background in electromagnetism, scientific publications in international journals and conferences, academic teaching experience, experimental and laboratory experience, programming and simulation (Matlab, C, COMSOL, AWR Microwave Office, HFSS), technical and scientific writing, microscopy, electronic and photonic devices, and RF and Microwave systems. Check my profile for my experience. Short Bio: Gianluca Fabi received his B.S. degree in 2015 from Marche Polytechnic University (Ancona, Italy) and his M.S. degree in 2017 from Politecnico di Torino (Turin, Italy), both in Electronics Engineering and summa cum Laude. He obtained his Ph.D. at the Department of Information Engineering of Marche Polytechnic University, Ancona, Italy, where he was also a PostDoctoral associate. He spent one year as a PostDoctoral associate at the Department of Electrical and Computer Engineering at Cornell University (Ithaca, NY, USA), where he was the laboratory manager of the High-Frequency Test Laboratory (part of the Cornell NanoScale Facility - CNF). He also conducted other research activities at Lehigh University (Bethlehem, PA, USA) and the Grenoble Institute of Technology, IMEP-LAHC (Grenoble, France), as an invited Ph.D. student, and intern, respectively. His research focuses on scanning microwave microscopy techniques, microwave heating, and impedance spectroscopy. He is now a consultant and contract professional electronic circuit designer and R&D engineer. -Type my name in Google Scholar or LinkedIn if you are curious about my research activities! -Main expertise: RF and MW engineering, laboratory measurements, programming, electromagnetic simulations, scientific and technical writing, microscopy, optics, electronics. -Software Skills: Matlab, COMSOL Multiphysics, KiCAD, LTSpice, HFSS, Microsoft suite, C language, Latex, Gwyddion. -Reviewer for the IEEE Journal Transactions on Microwave Theory and Techniques (TMTT), and Transaction on Instrumentation and Measurements (TIM).