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Oleksandr G.

@AlexandrGergel

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5,0
12

5,3

5,3

92%

C/C++ | WindowsKernel/LinuxKernel/EmbeddedOS

$48 USD / hora

・

Bandera de

Ukraine (1:41 a. m.)

・

Se unió el septiembre 29, 2021

・

1 Recomendación

$48 USD / hora

・

Experienced embedded system engineer with a passion for bringing products to life. With more than 15 years of experience in the industry, has a proven track record in firmware development, hardware integration, and product launches. Driven by a desire to solve problems and create value for customers. ☑️ language Assembly, C Programming, C++, Python, Shell script, Makefile ☑️ System Programming Real-time Operaing systems, Embedded Linux, Linux device driver, Windows device driver ☑️ High level programming Win32, Linux user space, Android NDK, Qt, MFC ☑️ Firmware Programming PIC microcontroller, ATMEL, ATMEGA, STM32, Nordic, ESP32, Arduino, Raspberry PI ☑️ Embedded Communication protocol I2C, Serial Peripheral Interface(SPI), UART, USB, GPIO, Controller Area Network(CAN), Recommended Standard 232(RS232), one-wire, Recommend Standard 485(RS485), Bluetooth ☑️ Hardware design Circuit design, schematic design, PCB design, Multi-layer PCB design, Electronic design, Altium designer ☑️ Debugging JTAG, GDB, Print ☑️ Reversing IDA, OllyDbg, 2-layer PCB reversing ☑️ Security Executable file behavior analyzing, Executable file static analyzing Website security analyzing, Troubleshoot PC security level

Verificaciones

A tiempo

100 %

Dentro del presupuesto

100 %

Aceptar tarifa

94 %

Tasa de recontratación

5 %

Freelancer C Programmers Ukraine
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Portafolio

Portafolio

10666934
High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

10666933
The previous cashier system in the shop is running on a windows system. However, the windows system needs to be equipped with hardware that can run windows, so the cost is very high, and the cash register system uses very limited software. So the customer wants to develop an Android-based POS machine. The client offered detailed hardware information, such as what interfaces and dimensions should be around. We designed the development board then based on the hardware characteristics of the development board, we carried out the configuration of the Android system. Android version is 5.0 lollipop CPU RK3288 & RAM 4GB 32G eMMC Support 2 touch screen Support hot boot Support 8-channel USB2.0 Support HDMI

POS Machine Android System Customize

10666926
Musical Spectrum Analyzer (MSA) is one of our real-time display systems. It reacts in real-time with music tone. The 14-band sampling frequency points are: 42Hz 100Hz 280Hz 700Hz 1.6kHz 4kHz 10kHz 63Hz 160Hz 400Hz 1kHz 2.5kHz 6.25kHz 16kHz Working voltage: 5V Audio interface: Bluetooth https://arksoft.dev/musical-spectrum-analyzer/

Musical Spectrum Analyzer

10666899
Air quality monitoring systems (AQMS) integrate measurements and modeling using smart homes to assess climate change impacts on indoor air quality.

Air Quality Monitor Systems

Air quality monitoring systems (AQMS) integrate measurements and modeling using smart homes to assess climate change impacts on indoor air quality.

Air Quality Monitor Systems

Air quality monitoring systems (AQMS) integrate measurements and modeling using smart homes to assess climate change impacts on indoor air quality.

Air Quality Monitor Systems

10666934
High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

High-speed (HDMI, DDR) HDI (high-density interconnect) with blind and buried vias Fine pitch BGAs 0.4 mm and 0.5 mm Power boards RF Bluetooth Wi-Fi Lora Design with fine-pitch BGA and QFN assembly Flex and rigid-flex design Chip evaluation and chip characterization Radio frequency design Stacked and staggered microvias IPC class 2 and class 3/ES DFM/DFA layout validation included

PCB Design

10666933
The previous cashier system in the shop is running on a windows system. However, the windows system needs to be equipped with hardware that can run windows, so the cost is very high, and the cash register system uses very limited software. So the customer wants to develop an Android-based POS machine. The client offered detailed hardware information, such as what interfaces and dimensions should be around. We designed the development board then based on the hardware characteristics of the development board, we carried out the configuration of the Android system. Android version is 5.0 lollipop CPU RK3288 & RAM 4GB 32G eMMC Support 2 touch screen Support hot boot Support 8-channel USB2.0 Support HDMI

POS Machine Android System Customize

10666926
Musical Spectrum Analyzer (MSA) is one of our real-time display systems. It reacts in real-time with music tone. The 14-band sampling frequency points are: 42Hz 100Hz 280Hz 700Hz 1.6kHz 4kHz 10kHz 63Hz 160Hz 400Hz 1kHz 2.5kHz 6.25kHz 16kHz Working voltage: 5V Audio interface: Bluetooth https://arksoft.dev/musical-spectrum-analyzer/

Musical Spectrum Analyzer

10666899
Air quality monitoring systems (AQMS) integrate measurements and modeling using smart homes to assess climate change impacts on indoor air quality.

Air Quality Monitor Systems

Air quality monitoring systems (AQMS) integrate measurements and modeling using smart homes to assess climate change impacts on indoor air quality.

Air Quality Monitor Systems

Air quality monitoring systems (AQMS) integrate measurements and modeling using smart homes to assess climate change impacts on indoor air quality.

Air Quality Monitor Systems

5.0 · 12 Comentarios
Opiniones
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Oleksandr (Alex) is the best technical expert you could find for any C/C++/Linux/Shared Memory/IPC work! Low level programming is his expertise and he understands the work quickly. Really encourage you to work with Alex.

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hace 3 años

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Experiencia

Senior RTOS Engineer

may, 2021 - Presente

•

4 años, 8 meses

Jabil

may, 2021 - Presente

•

4 años, 8 meses

1. Wearable device development with Linux system 2. AOSP building, RTOS configuration 3. RTOS device driver development with various sensors 4. BLE communication implementation 5. Setup remote hardware debug environment

may, 2021 - Presente

•

4 años, 8 meses

RTOS, Embedded Linux Engineer

may, 2015 - mar, 2020

•

4 años, 10 meses

BQ

may, 2015 - mar, 2020

•

4 años, 10 meses

Karaoke TV System development 1. Developing KTV system on STB device 2. Customizing the uCOS RTOS system 3. Deploy audio processing module(From FFMPEGՅ to system 4. Display subtitles with custom embedded vector font(MVF) 5. Made FAT32 filesystem encryption tool 6. Made ELF file parse tool Android POS machine development 1. Android OS building with hardware configuration 2. Hardware PCB Designing with Altium designer 3. Character Linux driver development 4. Block Linux driver development

may, 2015 - mar, 2020

•

4 años, 10 meses

Educación

National Technical University of Ukraine 'Igor Sikorsky Kyiv Polytechnic Institute'

2001 - 2006

•

5 años

MDCS

Bandera de

Ukraine

2001 - 2006

•

5 años

Calificaciones

QCS

2009

National Technical University of Ukraine

Qualifications of Computer Science.

2009

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