Am Raja from India. I have 4+ years working experience in pcb layout design,Mechanical 3d modeling. Fluent in Mentor Expedition, Cadence Allegro, Mentor PADS, Altium Designer pcb layout tools. Experience in creating footprints library, pcb layout, constraint editing, gerber generation. Certified Interconnect Designer (IPC CID) 2015. Basic understanding on DFM, DFT and appication on Valor DFM tool. Experience in routing high speed signals such as usb3.0, sata, pcie, lvds etc.
Experience in routing double-sided, 4-layers, 6layers,8layers and more layers pcb stackup.
strong high speed layout skills including differential pair, impedance control, matched delay, etc
Experience with isolation requirements,
Experience designing high density boards that incorporate microprocessors, DDR2 and DDR3 memory and peripherals, including layout experience with BGA parts
Experience in board layout involving communication protocols such as Ethernet, USB, I2C, etc
Solid knowledge of board fabrication process
Experience with Switch Mode Power Supply layout techniques
Experience with high-speed digital hardware design
Responsibilities:
Schematic capture, symbol creation, placement,3d model assign, connection, netlist and BOM generation using Various Cad Tools
Complete Placement and Layout of HDI Circuit Board Designs and FPC’s with Cadence Allegro PCB Editor,Mentor Graphics pads,Altium,Eagle..
Generate all Fab and Assembly Packages (ODB++ or IPC-2581).
Working with assembly and manufacturing dr